MC74HC174A |
RFQ for MC74HC174A Required Field |
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| Technical/Catalog Information | MC74HC174ADG |
| Vendor | ON Semiconductor |
| Category | Integrated Circuits (ICs) |
| Mounting Type | Surface Mount |
| Package / Case | 16-SOIC (3.9mm Width) |
| Function | Reset |
| Number of Bits per Element | 6 |
| Number of Elements | 1 - Single |
| Current - Output High, Low | 5.2mA, 5.2mA |
| Output Type | Non-Inverted |
| Trigger Type | Positive Edge |
| Type | D-Type Bus |
| Packaging | Tube |
| Operating Temperature | -55°C ~ 125°C |
| Delay Time - Propagation | 24ns |
| Frequency - Clock | 35MHz |
| Voltage - Supply | 2 V ~ 6 V |
| Lead Free Status | Lead Free |
| RoHS Status | RoHS Compliant |
| Other Names | MC74HC174ADG MC74HC174ADG MC74HC174ADGOS ND MC74HC174ADGOSND MC74HC174ADGOS |
| Product | Manufacturers | Pack | D/C |
| MC74HC174A | - | - | 2001 |
The MC74HC174A is identical in pinout to the LS174. The device inputs are compatible with standard CMOS outputs; with pullup resistors, they are compatible with LSTTL outputs.
This device consists of six D flipflops with common Clock and Reset inputs. Each flipflop is loaded with a lowtohigh transition of the Clock input. Reset is asynchronous and activelow.
Features |
| • Output Drive Capability: 10 LSTTL Loads• TTL NMOS Compatible Input Levels• Outputs Directly Interface to CMOS, NMOS, and TTL• Operating Voltage Range: 4.5 to 5.5 V• Low Input Current: 1.0 mA• In Compliance with the Requirements Defined by JEDEC Standard No. 7A• Chip Complexity: 162 FETs or 40.5 Equivalent Gates |
| Symbol | Parameter | Value | Unit |
| vcc | DC Supply Voltage (Referenced to GND) | 0.5 to +7.0 | V |
| VIN | DC Input Voltage (Referenced to GND) | 0.5 to VCC + 0.5 | V |
| VOUT | DC Output Voltage (Referenced to GND) | 0.5 to VCC + 0.5 | V |
| LIN | DC Input Current, per Pin | ±20 | mA |
| IOUT | DC Onput Current, per Pin | ±25 | mA |
| ICC | DC Supply Current Per Supply Pin | ±50 | mA |
| PD | Power dissipation in still air piastic DIP SOIC package |
750 500 |
mW |
| TSTG | Storage Temperature | 65 to +150 | °C |
| TL | Lead Temperature, 1 mm from Case for 10 Seconds (Plastic DIP or SOIC Package) |
260 | °C |
